Xiaomi went through the Mobile World Congress in a rather discreet way, not because its stand did not attract attention – but because the company decided not to announce any new product. Their next big release is booked for March 27 and will be the Xiaomi Mi Mix 2S , but they still have another ace up their sleeve.
We speak of the Xiaomi Mi 7. According to Geekbench, the Xiaomi Mi 7 codenamed as Dipper Appears will have the Snapdragon 845 chip, something that does not take us by surprise since the CEO of Xiaomi confirmed that this would be the processor of his next flagship. Next to the chip we would have 6 GB of RAM and on the Android 8.0 Oreo software side. Other technical details previously leaked include a 6-inch OLED panel and a 3,400 mAh battery.
In addition to these technical details, XDA Developers also gave clues to the possible design and performance of the device thanks to details extracted from the firmware.
At the moment, the Xiaomi Mi 7 has no confirmed presentation date but rumours suggest that the device could be announced in June this year, so there is still time to know all its details. Meanwhile, this March 27, we have an appointment with the Xiaomi Mi MIX 2S.
Via | Gizmochina